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Bavaria's new center for AI chips: TUM and TSMC are pushing technology forward!
The MACHT-AI Center for AI chip design is being built at TUM, funded by TSMC and the Bavarian state government.
Bavaria's new center for AI chips: TUM and TSMC are pushing technology forward!
A new education, training and research center for AI chip design has been founded at the Technical University of Munich (TUM), known as the Munich Advanced Technology Center for High-Tech Chips (MACHT-AI). This center will not only promote the training of future engineers, but also strengthen Europe's competitiveness in the field of semiconductor technologies. TUM has the Taiwanese semiconductor manufacturer TSMC as an important partner, providing both technical expertise and resources.
The head of the MACHT-AI Center is Professor Hussam Amrouch, who specializes in AI processor design. The Bavarian state government is supporting the project with 4.475 million euros from the budgets of the ministries of science and economics. Over the next five years, more than 300 students and researchers will be trained in engineering and computer science to become competent in the design and development of AI chips.
Goals and perspectives of the MACHT-AI Center
The main goal of the center is to provide the necessary knowledge and skills. High demand is expected for the first workshops, which are scheduled to take place in spring next year. Professor Amrouch emphasizes the participants' responsibility to develop innovative solutions for the market. Researchers at Prof. Amrouch’s chair are currently developing the workshop content.
In addition, students and researchers from other Bavarian universities will also be able to take part in the workshops in the future, which will further increase the reach and influence of the center.
Strategic relevance for the European chip industry
The founding of the MACHT-AI Center fits into a broader context. Loud Techovedas aims to strengthen Europe's ability to design and develop high-performance chips for AI, automotive and Industrial Internet of Things (IoT) applications. The initiative also supports the EU Chips Act, passed in 2023, which aims to double the European market share in the semiconductor sector to 20% by 2030.
An important aspect of the partnership is TSMC's contribution of know-how, particularly in FinFET manufacturing processes, which are crucial for the development of AI chips tailored to the needs of the European industry. This collaboration is seen as a strategic building block for the revitalization of the European semiconductor industry and could particularly benefit the innovative strength of the automotive industry in Germany.
TUM and TSMC have already announced that a chip design center in Munich will go into operation in the third quarter of 2023. TSMC is also involved in a significant manufacturing project in Dresden as part of a joint venture with the European Semiconductor Manufacturing Company (ESMC). This facility will be able to efficiently utilize advanced technologies by producing 40,000 300mm wafers per month.
In summary, the partnership between the Technical University of Munich and TSMC is not only an educational initiative, but is also interpreted as a key measure to strengthen Europe in the global semiconductor market.